Biscuit and Cake Packaging

Biscuit and Cake Packaging

Biscuit and Cake Packaging

We offer packaging solutions in desired material structures for biscuit, wafer and cake product groups or structures that require high barrier properties by using single, double or multi-layer structure combinations as packaging structure.

  •  High barrier
  •  Low oxygen and water vapor permeability
  •  Protection from light
  •  Low COF value
  •  Cold seal application for heat resistant products
  •  High lamination strength
  •  Low thermal adhesion
  •  Matt lacquer application
  •  Paper touch application

OPP

OPP / OPP

OPP / OPAK OPP

OPP / PEARLIZED

OPP / METALIZED OPP

OPP / OPAQUE OPP + CS

OPP / PEARLIZED + CS

OPP / METALIZED OPP + CS

Do you want us to be your solution partner?

Fill out our request form to meet Üçsa Ambalaj quality and cooperate with us, and our representatives will contact you.

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To get more information about ÜÇSA Ambalaj, please contact us.